The Integrated Vision System (IVS)

The Integrated Vision System (IVS) is a prototype stand-off instrument that's mounted on a rover mast for exploration of the lunar surface. 

Insturment Concept: 

- Multispectral imager (MSI) and multi-wavelength LIDAR
- Mounted on rover mast via pan/tilt unit – 360° coverage

Primary Goal:

Support lunar surface science and enable the selection of samples for return to Earth by

- Creating outcrop-scale geological and terrain maps
- Characterizing the compositional diversity of the lunar surface

Key Operation Tasks:

- Integrate the operation of Silicon and InGaAs multispectral image sensors to cover wide range of spectrum (from UV to SWIR).
- Provide radiometrically calibrated images of selected bands or all bands (depending on mode of operation) for terrain classification or characterizing site/feature of interest.
- Provide images for photo-realistic map generation of LIDAR.
- Specify ROI for LIDAR in intensity scan mode of operation.

Project Team: 

P-I: Dr. Gordon Osinski
Co-I: Dr. Jayshri Sabarinathan
Co-I: Dr. Aref Bakhtazad
Co-I: Dr. Livio Tornabene
Co-I: Dr. Eric Pilles 

Students: James Burley, Jin Sing Sia, Stephen Amey, Vidhya Rangarajan, Nicholas Mitchell, Wen Bo

Partner organization

This project is implemented in colloboration with MDA, an international space mission partner and a robotics, satellite systems and geointelligence pioneer. 

Project Resources 

Osinski G. R., Cross M., Pilles E., Sabarinathan J., and Tornabene L. L. 2019. An Integrated Vision System for future lunar surface missions (abstract #5019). 2019 Lunar Exploration and Analysis Group Annual Meeting. Washington D. C., October 2019 (poster).

Pilles E. A., Osinski G. R., Tornabene L. L., Sabarinathan J., Bakhtazad A. 2021. Development of an Integrated Vision System (IVS) for Characterization of the Lunar surface. In: Earth and Space 2021: Space Exploration, Utilization, Engineering, and Construction in Extreme Environments, Seattle, USA. Editors: van Susante P. J. and Dickason Roberts A. pp. 541–554.